Semiconductor power module

Details Semiconductor power module Semiconductor power module

2006-01-10

2006-01-10

Thomas, Tom (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S691000, C257S678000, C257S701000, C257S584000, C361S728000, C361S772000, C174S050510, C174S050510

Reexamination Certificate

active

06984883

ABSTRACT:
An insulating substrate (17) includes a surface conductive layer (25) fixedly laminated on a surface of the plate-like semiconductor body (21) via a surface side fixing member (24, 26). The surface side fixing member (24, 26) includes a first fixing portion (26) for fixing one part (25a) of the surface conductive layer (25) located underneath the joint portion (15) of the electrode terminal (14), and a second fixing portion (24) for fixing the other part (25b) of the surface conductive layer (25) which is not located underneath the joint portion (15), and a fixing strength exhibited by the first fixing portion (26) is smaller than that exhibited by the second fixing portion (24).

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