Semiconductor power module

Details Semiconductor power module Semiconductor power module

1987-06-04

1988-02-23

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 804, 16510433, 174 15HP, 357 82, 361385, H01L 2324

Patent

active

047274549

ABSTRACT:
A semiconductor power module includes a substrate formed of metallized ceramic, at least one semiconductor power component with a base surface soldered to the metallized ceramic, and at least one heat conduit integrated into the semiconductor power module. The heat conduit includes a condensation area having a larger surface than the base surface, over which dissipation heat from the semiconductor power component is distributed.

REFERENCES:
patent: 3361195 (1968-01-01), Meyerhoff et al.
patent: 3651865 (1972-03-01), Feldmanis
patent: 3971435 (1976-07-01), Peck
Ronkese, "Centerless Ceramic Package with Directly Connected Heat Sink", IBM Tech. Disclosure Bulletin, vol. 20, No. 9, 2/78, pp. 3577-3578.
Brunsch et al., "Semiconductor Chip Cooling System with Temperature Regulation," IBM Tech. Disclosure Bulletin, vol. 24, No. 9, 2/82--pp. 4796-4797.

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