Semiconductor power module

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Patent

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Details

361388, H05K 500

Patent

active

044369514

ABSTRACT:
Semiconductor power module, including a substantially prismatic plastic housing with a lower surface having a recess with a shoulder-like step formed in the periphery thereof, a ceramic plate being inserted into the step and having an outer flat surface extending beyond the lower surface of the housing and an inner flat surface facing the interior of the housing, metallizations, semiconductor components and solder jumpers disposed on the inner surface of the ceramic plate, external contact elements being disposed on the inner surface of the ceramic plate and being freely accessible from on top of the housing, the housing including a frame having an open top and bottom, a central fastening part having a lower surface and having a hole formed therethrough for fastening the module to a heat sink, and radially-directed spokes extended between the frame and the central fastening part, the ceramic plate being braced against the lower surface of the central fastening part and having a breakthrough formed therein in alignment with the through hole, the spokes being disposed at a distance from the ceramic plate defining a space therebetween, and each of the external contact elements being separated from each other by at least one spoke, and hardened insulating casting compound filling substantially half of the interior of the housing.

REFERENCES:
patent: 3801728 (1974-04-01), Gallo et al.
patent: 4218724 (1980-08-01), Kaufman

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