Semiconductor power module

Details Semiconductor power module Semiconductor power module

1996-05-15

1997-12-30

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257724, 257787, 257796, 257675, H01L 2334

Patent

active

057033994

ABSTRACT:
A blanked lead frame serves both as an interconnection pattern for a control circuit and a power circuit and as external terminals. Highly heat conducting resin having an electric insulating property is put between the lead frame and the heat sink arranged to face each other to maintain good thermal conductivity therebetween. The heat sink and the lead frame are coupled easily and fixedly by performing a simple process of sealing with the highly heat conducting resin. Accordingly, no expensive circuit boards are required, which have been necessary in conventional devices, nor a process of patterning the interconnection pattern and a process of connecting the external terminals to the interconnection pattern when manufacturing the device required. That is to say, the manufacturing cost is reduced without deteriorating the heat radiating characteristic.

REFERENCES:
patent: 5057906 (1991-10-01), Ishigami
patent: 5424250 (1995-06-01), Sawada
patent: 5466969 (1995-11-01), Tsunoda

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