Semiconductor polishing composition

Details Semiconductor polishing composition Semiconductor polishing composition

2005-03-28

2009-11-03

Marcheschi, Michael A (Department: 1793)

Abrasive tool making process, material, or composition

With inorganic material

Clay, silica, or silicate

C106S003000, C438S690000, C438S691000, C438S692000, C438S693000

Reexamination Certificate

active

07611552

ABSTRACT:
A semiconductor polishing composition is disclosed. The composition includes fumed silica. The semiconductor polishing composition is an aqueous dispersion solution of fumed silica. Further, the number of particles of fumed silica having a particle diameter of 0.5 μm or more is 600,000 pieces/ml or less and the number of particles of fumed silica having a particle diameter of 1 μm or more is 6000 pieces/ml or less.

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International Search Report dated May 6, 2005.

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