Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate
2007-07-02
2009-08-11
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
With shielding
C257SE23114
Reexamination Certificate
active
07573124
ABSTRACT:
A semiconductor packaging structure having electromagnetic shielding function is disclosed, in which the packaging structure includes a carrier and a semiconductor substrate disposed thereon. The semiconductor substrate has a patterned passivation layer and a patterned metal layer disposed thereon, in which the patterned metal layer is electrically connected to at least a grounding pad of the carrier via a wire, whereby possessing the semiconductor packaging structure to have electromagnetic shielding function. A method for manufacturing a semiconductor packaging structure having electromagnetic shielding function is also disclosed in the present invention.
REFERENCES:
patent: 6060774 (2000-05-01), Terui
patent: 7245011 (2007-07-01), Liu
patent: 2006/0102992 (2006-05-01), Kwon et al.
patent: 2006/0113640 (2006-06-01), Yu et al.
Hsiao Wei-Min
Peng Sheng-Yang
Wang Meng-Jen
Yang Kuo-Pin
Advanced Semiconductor Engineering Inc.
Harriston William
Hsu Winston
Pert Evan
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