Semiconductor packaging method to save interposer

Details Semiconductor packaging method to save interposer Semiconductor packaging method to save interposer

2011-04-19

2011-04-19

Richards, N Drew (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S106000, C438S107000, C438S108000, C438S110000, C257S686000, C257S698000, C257S723000, C257S738000, C257S724000

Reexamination Certificate

active

07927919

ABSTRACT:
A semiconductor packaging method without an interposer is revealed. A mother chip is a two-layer structure consisting of a semiconductor layer and an organic layer where a redistribution layer is embedded into the organic layer with a plurality of first terminals and a plurality of second terminals disposed on the redistribution layer and exposed from the organic layer. The mother chip is flip-chip mounted on the substrate. The active surface of the daughter chip is in contact with the organic layer with the bonding pads of the daughter chip bonded to the first terminals. Furthermore, a plurality of electrically connecting components electrically connect the second terminals to the substrate. In the multi-chip stacked package, the interposer can be eliminated with a thinner overall package thickness as well as controlled package warpage.

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