Semiconductor packaging device

Details Semiconductor packaging device Semiconductor packaging device

2007-12-28

2011-10-11

Dickey, Thomas L (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257SE23172, C257SE21002, C438S780000

Reexamination Certificate

active

08035220

ABSTRACT:
Embodiments of the invention relate to a semiconductor module and to a method for manufacturing a semiconductor module. In an embodiment of the invention, a semiconductor module for mounting to a board may include at least an integrated circuit having connections on at least one side of the integrated circuit, and at least a first layer which is applied to the side of the integrated circuit having the connections, wherein the free surface of the first layer facing away from the integrated circuit has a thermo-mechanical linear expansion in the in-plane direction of the surface which corresponds to the thermo-mechanical linear expansion of the board to which the semiconductor module is to be mounted.

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Doi. Hiroaki, Semiconductor Package, Nov. 20, 1991, JP 403290952A (japanese patent No.).

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