Semiconductor packaging device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

257667, 257787, 361813, H05K 702, H01L 2328

Patent

active

059826258

ABSTRACT:
A semiconductor packaging device includes a printed circuit board substrate, a mold gate formed on a periphery of the printed circuit board substrate through which a package encapsulant is poured to enclose electric elements mounted on a side of the printed circuit board, and a layer of non-metallic material covered on the side of the printed circuit board substrate in the mold gate area. The package encapsulant, after hardened, is bonded with the layer of non-metallic material, and the bonded package encapsulant/the layer of non-metallic material is degatable from the mold gate.

REFERENCES:
patent: 5635671 (1997-06-01), Freyman et al.
patent: 5708300 (1998-01-01), Woosley et al.
patent: 5780933 (1998-07-01), Ohmori et al.
patent: 5859475 (1999-01-01), Freyman et al.
patent: 5886398 (1999-03-01), Low et al.

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