Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-08-08
2006-08-08
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000, C257S698000
Reexamination Certificate
active
07087988
ABSTRACT:
An exemplary embodiment of the present invention described and shown in the specification and drawings is a semiconductor packaging apparatus that includes a first substrate for coupling to an electronic component, and a second substrate for accommodating the electronic component coupled to the first substrate.
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Clark S. V.
Hogan & Hartson LLP
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