Semiconductor packaging and method

Details Semiconductor packaging and method Semiconductor packaging and method

1986-05-15

1987-06-09

Lee, John

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 74, 361402, 361411, H01L 3902

Patent

active

046724214

ABSTRACT:
A mounting means for a semiconductor integrated circuit, the mounting means comprising a semiconductor material having a mounting surface as one major surface thereof, a semiconductor integrated circuit mounted on the major surface of the semiconductor material, and means for electrically connecting the integrated circuit to the semiconductor material. The mounting means has a coefficient of thermal expansion similar to the semiconductor integrated circuit mounted thereon.

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IBM Technical Disclosure Bulletin, "Forming Burried Layer by Diffusion," O. R. Viva et al., vol. 11, No. 10, pp. 1342-1343, (3/1969).
IBM Technical Disclosure Bulletin, "Integrated Circuit Chip Package," C. N. Liu et al., vol. 17, No. 7, p. 2018, (12/1974).

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