Semiconductor packages having electromagnetic...

Details Semiconductor packages having electromagnetic... Semiconductor packages having electromagnetic...

2011-06-21

2011-06-21

Coleman, W. David (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

With means to shield device contained in housing or package...

C257SE23114, C257SE21076, C438S121000

Reexamination Certificate

active

07964938

ABSTRACT:
The present invention relates to relates to a semiconductor package having a function of shielding electromagnetic interference (EMI), a manufacturing method thereof and a jig, and more particularly, to such a semiconductor package having an electromagnetic interference (EMI)-shielding function, a manufacturing method thereof and a jig for use in a plasma sputtering, in which a nickel alloy is coated on the surface of a semiconductor package by a sputtering method so as to shield electromagnetic interference (EMI) generated from the semiconductor package.

REFERENCES:
patent: 6707682 (2004-03-01), Akiba et al.
patent: 2009/0086461 (2009-04-01), Lee
patent: 2009/0212401 (2009-08-01), Do et al.
patent: 2009/0294928 (2009-12-01), Kim et al.
patent: 2009/0294931 (2009-12-01), Sham et al.
patent: 2009/0302439 (2009-12-01), Pagaila et al.
patent: 2010/0244024 (2010-09-01), Do et al.

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