Semiconductor packages for high I/O semiconductor dies

Details Semiconductor packages for high I/O semiconductor dies Semiconductor packages for high I/O semiconductor dies

1994-08-22

1996-07-09

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437211, 437214, 437217, 437220, H01L 2160

Patent

active

055344674

ABSTRACT:
Techniques for providing semiconductor packages capable of forming connections to "high I/O" semiconductor dies is described, wherein there are at least two distinct pluralities of conductive lines. Leadframe-type packages and substrate-based package embodiments are described.

REFERENCES:
patent: 4542259 (1985-09-01), Butt
patent: 5034350 (1991-07-01), Marchisi
patent: 5172214 (1992-12-01), Casto
patent: 5206188 (1993-04-01), Hiroi et al.
patent: 5340771 (1994-08-01), Rostoker

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