Semiconductor packages and methods for making the same

Details Semiconductor packages and methods for making the same Semiconductor packages and methods for making the same

2005-05-10

2005-05-10

Cuneo, Kamand (Department: 2827)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000

Reexamination Certificate

active

06891108

ABSTRACT:
Semiconductor package support elements including cover members attached to one or more reject die sites. Also, methods for making the support elements and for making semiconductor packages using the same. Reject die sites on defective substrates of a support element are covered prior to the encapsulation process using a cover member. The cover member comprises, for example, pressure-sensitive or temperature-activated tape, reject dies, or the like. The support elements and methods of the present invention virtually eliminate bleeding or flashing during encapsulation due to the presence of reject die sites. The support elements and methods of the present invention further ensure that functional dice are not sacrificed by being attached to reject die sites, thereby decreasing manufacturing costs while increasing yield of functional semiconductor packages.

REFERENCES:
patent: 4704304 (1987-11-01), Amendola et al.
patent: 5504373 (1996-04-01), Oh et al.
patent: 5723907 (1998-03-01), Akram
patent: 6301121 (2001-10-01), Lin
patent: 6489218 (2002-12-01), Kim et al.

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