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1982-12-29

1985-06-18

Grimley, A. T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, 357 81, H05K 504, H05K 506

Patent

active

045242380

ABSTRACT:
Various embodiments of a casing adapted to receive an electronic device and in particular power discrete devices are disclosed. The casings include metal or metal alloy base components with the electronic device adhered to its surface. A metal or metal alloy leadframe is bonded to and electrically insulated from the base component. The electronic device is connected to the leadframe. A metal or metal alloy cover is bonded to the leadframe to seal the electronic device within the casing. Each of the modifications includes a technique for effectively removing the heat generated by the electronic device from the casing.

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Charles A. Harper, "Handbook of Electronic Packaging", pp. 9-27.
Hammer et al., "Thick Film Highbred Microcircuit Technology", pp. 295-298.

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