Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1996-11-14
2000-01-04
Reichard, Dean A.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
257666, H01L 2302
Patent
active
060112204
ABSTRACT:
In a semiconductor packaged device of an LOC structure, a lead frame is formed having leads which extend in two directions from a semiconductor chip. The lead frame further includes dummy frames which extend in the two directions opposite of the directions in which the leads extend. The dummy frames are located below the center line (drawn half-way between the upper surface and undersurface of the device) by depressing the dummy frames before the semiconductor chip is mounted on the lead frame. The inner lead portions of the leads are each adhered to the surface of the semiconductor chip through a tape and connected to electrode pads on the semiconductor chip using bonding wires. The semiconductor chip and its periphery is then sealed with mold resin.
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Bando Ryujiro
Ito Seigo
Saigusa Masateru
Kabushiki Kaisha Toshiba
Ngo Hung V
Reichard Dean A.
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