Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
1999-05-04
2001-07-03
Nguyen, Vinh (Department: 2858)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S755090
Reexamination Certificate
active
06255840
ABSTRACT:
FIELD OF THE INVENTION
This invention relates generally to semiconductor manufacture and more particularly to an improved semiconductor package having a protective member for the wires and wire bonds of an interconnect for the package.
BACKGROUND OF THE INVENTION
Temporary packages are used in the testing of bare semiconductor dice. For example, temporary packages can be used in place of conventional plastic or ceramic semiconductor packages for testing bare dice. One type of temporary package is adapted to contain a single bare die, or a chip scale package, for burn-in testing. This type of package can include a base for holding the die, and an interconnect component that mounts to the base. The interconnect provides temporary electrical connections between contacts on the die and terminal contacts (e.g., J-bend pins) formed on the base. The terminal contacts are adapted to electrically connect to a burn-in board, or other testing apparatus, in electrical communication with testing circuitry.
One method for mounting the interconnect to the base involves wire bonding. With this method, the interconnect includes conductors (e.g., traces) in electrical communication with contact members. The contact members on the interconnect are configured to electrically connect to contacts on the die (e.g., test pads, bond pads). The base includes conductors (e.g., internal traces) in electrical communication with the terminal contacts. Wires can be bonded to the conductors on the interconnect and the conductors on the base to form electrical paths therebetween. These wires are herein referred to as “wires”, and their bonded connections are referred to as “wire bonds”.
In some cases the wires are made relatively long to provide improved electrical characteristics for the package. For example, aluminum alloy wires used for wirebonding, typically have a lower resistance than the thin film conductors formed on the interconnect. Accordingly, it can be advantageous to make the wires as long as possible, and the thin film conductors as short as possible. This allows test procedures to be performed at higher speeds with lower resistance and reduced parasitics.
One problem with the long wires is that they tend to reduce the reliability of the temporary package. In particular, the wires can be bumped during handling and transport of the package causing sagging and shorting. The temporary packages are designed to be assembled and disassembled multiple times and the wires are often exposed. In addition, the wire bonds on the interconnect or base, are also subject to damage during continued usage of the temporary package. It would be advantageous for a temporary package to include some type of protection for the wires of the package and for the associated wire bonds. This would permit the wires to made as long as possible without compromising the performance of the temporary package.
SUMMARY OF THE INVENTION
In accordance with the present invention, an improved semiconductor package, system, and method for testing semiconductor dice are provided. The semiconductor package comprises a base for housing a single bare die; an interconnect for establishing temporary electrical communication with the die; and wires bonded to conductors on the base and interconnect. In addition, the semiconductor package includes a protective member adapted to protect the wires and associated wire bonds.
In an illustrative embodiment, the protective member comprises a plate configured for mating engagement with a mounting shelf on the base. The protective member protects the bonded wires, while at the same time allowing access to the interconnect for assembling the package and removing the tested die. In an alternate embodiment, the protective member comprises an epoxy resin or a silicone based elastomeric material, such as an epoxy resin, dispensed onto the wires and associated wire bonds as a “glob top” and then cured.
The base can include terminal contacts, such as pins or ball contacts, configured for mating electrical engagement with a testing apparatus, such as a burn-in board. In addition, conductors are formed on the base in electrical communication with the terminal contacts. The conductors terminate in bonding pads located on a bonding shelf of the base. Still further, a cover and force applying member are associated with the base to bias the die against the interconnect in the assembled package.
The interconnect includes contact members configured to electrically connect to contacts on the die. In addition, conductors are formed on the interconnect in electrical communication with the contact members, and terminate in bonding pads. Prior to a testing procedure using the package, the wires can be bonded to the bonding pads on the interconnect, and to the bonding pads on the base, to form electrical paths therebetween. During a package assembly procedure, the die can be aligned with the interconnect, and the cover and force applying member secured to the base. The assembled package can then be used to test the die. During a disassembly procedure, the tested die can be removed from the package. The protective member, in addition to protecting the wires and wire bonds during assembly and disassembly of the package, also provides protection during transport, storage and handling of the package.
A system constructed in accordance with the invention includes the assembled semiconductor package, and a testing apparatus such as a burn-in board. The testing apparatus is in electrical communication with testing circuitry adapted to apply test signals to the integrated circuits on the die. During the testing procedure, test signals can be applied through the terminal contacts and conductors on the package base, through the wires, through the conductors and the contact members on the interconnect, and to the contacts on the die.
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1994 DRAM Data Book, Micron Semiconductor, Inc., pp. 7-7—7-13, Apr., 1994.
Akram Salman
Farnworth Warren M.
Gochnour Derek
Hembree David R.
Gratton Stephen A.
Micro)n Technology, Inc.
Nguyen Vinh
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