Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1997-04-25
2000-02-15
Nguyen, Vinh P.
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
324765, G01R 3102
Patent
active
060257288
ABSTRACT:
A package, system and method for testing semiconductor dice are provided. The package include a base for retaining the die, and an interconnect having contact members for establishing temporary electrical connections with the die. Electrical paths are formed between terminal contacts on the base, and the contact members on the interconnect, by wires that are wire bonded to conductors on the base and interconnect. The package includes a protective member for protecting the wires and associated wire bonds during assembly, disassembly and handling of the package. The protective member can be formed as a plate mounted to the base and configured to cover the wires and wire bonds. Alternately the protective member can comprise an encapsulating material such as an epoxy resin or silicone elastomer deposited on the wires and wire bonds and then cured.
REFERENCES:
patent: D401567 (1998-11-01), Farnworth et al.
patent: 4969828 (1990-11-01), Bright et al.
patent: 4992850 (1991-02-01), Corbett et al.
patent: 5006792 (1991-04-01), Malhi et al.
patent: 5073117 (1991-12-01), Malhi et al.
patent: 5088190 (1992-02-01), Malhi et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5302891 (1994-04-01), Wood et al.
patent: 5322446 (1994-06-01), Cearley-Cabbiness
patent: 5367253 (1994-11-01), Wood et al.
patent: 5408190 (1995-04-01), Wood et al.
patent: 5424652 (1995-06-01), Hembree et al.
patent: 5440240 (1995-08-01), Wood et al.
patent: 5451165 (1995-09-01), Cearley-Cabbiness et al.
patent: 5468999 (1995-11-01), Lin et al.
patent: 5483174 (1996-01-01), Hembree et al.
patent: 5483741 (1996-01-01), Akram et al.
patent: 5495179 (1996-02-01), Wood et al.
patent: 5517125 (1996-05-01), Posedel et al.
patent: 5519332 (1996-05-01), Wood
patent: 5523697 (1996-06-01), Farnworth et al.
patent: 5530376 (1996-06-01), Lim et al.
patent: 5539324 (1996-07-01), Wood et al.
patent: 5541525 (1996-07-01), Wood et al.
patent: 5543725 (1996-08-01), Lim et al.
patent: 5581195 (1996-12-01), Lee et al.
patent: 5691649 (1997-11-01), Farnworth et al.
patent: 5783461 (1998-07-01), Hembree
patent: 5815000 (1998-09-01), Farnworth et al.
patent: 5834945 (1998-11-01), Akram et al.
patent: 5844418 (1998-12-01), Wood et al.
1994 DRAM Data Book, Micron Semiconductor, Inc., pp. 7-7-7-13, Apr., 1994.
Akram Salman
Farnworth Warren M.
Gochnour Derek
Hembree David R.
Gratton Stephen A.
Micro)n Technology, Inc.
Nguyen Vinh P.
LandOfFree
Semiconductor package with wire bond protective member does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package with wire bond protective member, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package with wire bond protective member will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1908640