Semiconductor package with under bump metallization aligned...

Details Semiconductor package with under bump metallization aligned... Semiconductor package with under bump metallization aligned...

2008-04-24

2011-10-04

Williams, A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257SE23023, C257SE21502, C257S738000, C257S778000, C257S780000, C257S781000, C257S779000, C257S772000, C257S774000, C257S668000, C257S773000, C257S684000, C257S796000

Reexamination Certificate

active

08030768

ABSTRACT:
A semiconductor package with a semiconductor chip having under bump metallizations (UBMs) on a first surface and a substrate having open vias. The substrate is attached to the semiconductor chip with the UBMs in alignment with the open vias. An encapsulant surrounds the semiconductor chip and the substrate and a conductor fills the open vias to form external package connections.

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