Semiconductor package with through-hole

Details Semiconductor package with through-hole Semiconductor package with through-hole

2007-02-20

2007-02-20

Munson, Gene M. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S433000, C257S774000, C257S777000

Reexamination Certificate

active

10924205

ABSTRACT:
A semiconductor package of the invention comprises: a semiconductor element provided with a circuit element on one surface of a semiconductor substrate; an external wiring region provided on an other surface of the semiconductor substrate; a support substrate disposed on the one surface of the semiconductor substrate; an electrode pad disposed on the one surface of the semiconductor substrate; and a through-electrode which extends from the electrode pad through to the other surface of the semiconductor substrate.

REFERENCES:
patent: 6239495 (2001-05-01), Sakui et al.
patent: 6703689 (2004-03-01), Wada
patent: 6720661 (2004-04-01), Hanaoka et al.
patent: 6864172 (2005-03-01), Noma et al.
patent: 7022609 (2006-04-01), Yamamoto et al.
patent: 2002/0019069 (2002-02-01), Wada
patent: 2002/0030245 (2002-03-01), Hanaoka et al.
patent: 9-511097 (1997-11-01), None
patent: 2001-351997 (2001-12-01), None
patent: 3313547 (2002-05-01), None
patent: 2002-329852 (2002-11-01), None

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