Semiconductor package with tape mounted die

Details Semiconductor package with tape mounted die Semiconductor package with tape mounted die

1985-01-15

1987-03-10

Davie, James W.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174 52FP, 357 70, 357 72, 357 80, H01L 2302, H01L 2312

Patent

active

046494154

ABSTRACT:
A semiconductor package has a molded-in-place lead frame (15) resting on a ledge (12b) adjacent a die-receiving trough (13) in a molded housing (10). A one-layer or two-layer flexible tape includes a depending tab (22) on which a die (30) is bonded and positioned within the trough. Electrical bonds are made between bond pads (42) on the die, either by wire bonds (29) or thermo-compression bonding using connector bumps (32), and bond pads on the tape. The tape is laid across a pair of ledges (12a, 12b) with the depending die resting on the bottom of the trough. The tape bond pads are then bonded to inner-extending contact fingers (18) of the lead frame. A single-in-line package is provided in one embodiment wherein integral contacts (17) extend outwardly from fingers (18) exterior of the housing (10).

REFERENCES:
patent: 3404214 (1968-10-01), Elliott
patent: 3868724 (1975-02-01), Perrino
patent: 4234666 (1980-11-01), Gursky
patent: 4524238 (1985-06-01), Butt

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