Semiconductor package with leadframe inductors

Details Semiconductor package with leadframe inductors Semiconductor package with leadframe inductors

2006-01-03

2006-01-03

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S688000, C257S690000, C257S691000

Reexamination Certificate

active

06982479

ABSTRACT:
A semiconductor device in which an inductance element formed in a resin package has stable characteristics, impedance matching is achieved easily, and the stability of high-frequency characteristics is improved, more particularly a semiconductor chip sealed within mold resin having a conductor lead extending from an inside of the mold resin to an outside. A portion of the conductor lead inside the mold resin forms an inductance element, at least a part of which is narrower than the external portion of the conductor outside the mold resin.

REFERENCES:
patent: 3909726 (1975-09-01), Dobrovolny et al.
patent: 4967258 (1990-10-01), Fithian et al.
patent: 5905301 (1999-05-01), Ichikawa et al.
patent: 5994763 (1999-11-01), Ohmuro
patent: 6140702 (2000-10-01), Efland et al.
patent: 6621140 (2003-09-01), Gibson et al.
patent: 9-213826 (1997-08-01), None

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