Semiconductor package with internal heatsink and assembly method

Details Semiconductor package with internal heatsink and assembly method Semiconductor package with internal heatsink and assembly method

1997-04-08

1999-11-16

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361688, 361690, 361707, 361709, 361711, 361718, 361719, 257687, 257706, 257707, 257717, 257720, 257796, H05K 720

Patent

active

059868856

ABSTRACT:
A semiconductor package includes a semiconductor die, a lead frame and die attach paddle, and a thermally conductive metal foam porous sponge attached to the die attach paddle to conduct heat generated by operation of the die to the outside of the semiconductor package. In another embodiment the chip is mounted directly on the sponge. A flip-chip interconnection is also disclosed. In the method, a die and lead frame assembly is placed on a sponge in the cavity of a package two-part mold, the mold is closed and filled with encapsulant. A ball grid array semiconductor package with an internal sponge heatsink mounted directly on or in a substrate such as a printed circuit board with circuitry metallization, and a semiconductor die, wire-bonded or soldered to the metallization and adhered to the sponge heatsink, is also included.

REFERENCES:
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patent: 5358032 (1994-10-01), Arai et al.
patent: 5402004 (1995-03-01), Ozmat
patent: 5430331 (1995-07-01), Hamzehdoost et al.
patent: 5532513 (1996-07-01), Smith et al.
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5598321 (1997-01-01), Mostafazadeh et al.
patent: 5650662 (1997-07-01), Edwards et al.
Duocel brochure (2 pages), date prior to Apr. 1997.

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