Semiconductor package with integral heat dissipator

Details Semiconductor package with integral heat dissipator Semiconductor package with integral heat dissipator

1995-12-12

1997-05-13

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257706, 257707, 257693, 257675, 257717, H01L 2328, H01L 2334

Patent

active

056295618

ABSTRACT:
A highly integrated semiconductor package having a light and compact construction and heat dissipating means suitable to effectively dissipate heat generated from the package during the operation of the package is disclosed. The semiconductor package has a lower heat sink for dissipating heat generated from a semiconductor chip of the package. The package also has a tape attached to the top of a plurality of inner leads of the package. The inner leads are attached to the top surface of the lower heat sink. The package further has a heat dissipating means for dissipating heat generated from the inner leads. The heat dissipating means has a heat bar attached to the tape. An upper heat sink may be integrated with the heat bar so as to form the heat dissipating means.

REFERENCES:
patent: 5064968 (1991-11-01), Kovacs et al.
patent: 5280409 (1994-01-01), Selna et al.
patent: 5404273 (1995-04-01), Akagawa
patent: 5482898 (1996-01-01), Marrs

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