Semiconductor package with improved thermal emission property

Details Semiconductor package with improved thermal emission property Semiconductor package with improved thermal emission property

2005-12-06

2005-12-06

Mai, Anh D. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S734000, C257S737000, C257S738000

Reexamination Certificate

active

06972483

ABSTRACT:
Disclosed is a semiconductor package capable of improving a thermal emission property. The semiconductor package includes a substrate having a window, a first wiring, and a second wiring. A semiconductor chip is attached to the substrate. A metal pattern is formed at a pad-forming surface of the semiconductor chip. A first metal wire connects the bonding pad to a first bond finger and a second metal wire connects the metal pattern to a second bond finger. A sealing member is provided to seal the substrate. A first solder ball is attached to a first ball land and a second solder ball is attached to the second ball land.

REFERENCES:
patent: 6879030 (2005-04-01), Tsai et al.
patent: 2004/0016999 (2004-01-01), Misumi
patent: 2005/0098870 (2005-05-01), Thomas et al.

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