Semiconductor package with improved conduction cooling structure

Details Semiconductor package with improved conduction cooling structure Semiconductor package with improved conduction cooling structure

1978-10-02

1980-11-11

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361386, 174 16HS, H05K 720

Patent

active

042336457

ABSTRACT:
A semiconductor device package having a substrate, one or more semiconductor devices mounted on the top surface of the substrate, a heat sink having a surface in opposed spaced parallel relation to the top surface of the substrate, and at least one deformable heat transfer member positioned between a device mounted on the top surface of the substrate, and the surface of the heat sink. The heat transfer member is comprised of a porous block of material, and a heat conductive non-volatile liquid retained within the block of material by a surface tension. The heat transfer member being operative to transfer heat from the device to the heat sink.

REFERENCES:
patent: 4000776 (1977-01-01), Kroebig
patent: 4118756 (1978-10-01), Nelson
Metal Wool Heat Stud, Ronkese, IBM Tech. Discl. Bull., vol. 20, No. 3, Aug. 1977, p. 1122.
Cooling Device for Multilayer Ceramic Modules, Clark, IBM Tech. Discl. Bull. vol. 20, No. 5, Oct. 1977, p. 1769.
Device Cooling, Johnson, IBM Tech. Discl., vol. 20, No. 10, Mar. 1978, p. 3919.
Conduction Cooling Module, Hwang, IBM Tech. Discl. Bull., vol. 20, No. 11A, Apr. 1978, p. 4334.
Liquid Encapsulated Conduction Module, Hwang, IBM Tech. Discl. Bull., vol. 20, No. 7, Dec. 1977, p. 2759.

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