Semiconductor package with high density I/O lead connection

Details Semiconductor package with high density I/O lead connection Semiconductor package with high density I/O lead connection

1994-04-19

2000-10-03

Sherry, Michael J.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

H05K 720

Patent

active

RE0368946

ABSTRACT:
Disclosed is a semiconductor package which permits coupling of semiconductor bond pads to I/O leads where a high density of connections is needed. Conductive fingers backed by an insulating tape are bonded to the ends of the ringers on a lead frame. The tape fingers are electrically coupled to the bond pads on one major surface of the semiconductor chip by wire bonding. In one embodiment, the opposite major surface of the chip is bonded to a paddle on the lead frame through an aperture in the tape for maximum heat dissipation.

REFERENCES:
patent: Re31967 (1985-08-01), Burns
patent: 4371912 (1983-02-01), Guzik
patent: 4480013 (1984-10-01), Doi et al.
patent: 4498122 (1985-02-01), Rainal
patent: 4578697 (1986-03-01), Takemae
patent: 4631820 (1986-12-01), Harada et al.
patent: 4801765 (1989-01-01), Moyer et al.
U.S. application No. 816,443; Moyer and Scholz, filed Jan. 6, 1986.

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