Semiconductor package with flow controller

Details Semiconductor package with flow controller Semiconductor package with flow controller

2007-01-05

2009-11-03

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23023, C257SE21502, C257SE25013, C257SE25023, C257S685000, C257S777000, C257S723000, C257S784000, C257S786000, C257S737000, C257S738000, C257S778000, C257S780000, C257S779000, C257S678000

Reexamination Certificate

active

07612444

ABSTRACT:
A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that several semiconductor packages can be manufactured at once. A molding compound flow controller is optimally associated with the substrate or semiconductor package at one or more various locations. Flow controllers can control or direct the flow of the molding compound during the encapsulation process. Flow controllers can be sized, shaped, and positioned in order to smooth out the flow of the molding compound, such that the speed of the flow is substantially equivalent over areas of the substrate containing dies and over areas of the substrate without dies. In this manner, defects such as voids in the encapsulation, wire sweeping, and wire shorts can be substantially avoided during encapsulation.

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