Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2007-09-11
2007-09-11
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257SE23021, C257S737000, C257S738000, C257S786000, C361S760000, C361S770000, C174S250000, C174S050510, C228S180220, C228S180210, C228S248100
Reexamination Certificate
active
10902002
ABSTRACT:
A semiconductor package with an encapsulated passive component mainly includes at least a substrate having a surface, a passive component and a molding compound. A plurality of SMD pads (Solder Mask Defined pads) and a solder mask are formed on the surface of the substrate. Each SMD pad has an exposed sidewall portion exposed out of the solder mask. A blocking bar is formed between the exposed sidewall portions of the SMD pads. There is at least a flowing channel formed between the blocking bar and the exposed sidewall portions. The passive component is mounted on the surface of the substrate and connected to the SMD pads, the flowing channel is located under the passive component. It is advantageous to fill the molding compound into the flowing channel.
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Advanced Semiconductor Engineering Inc.
Chu Chris C.
Parker Kenneth
Troxell Law Office PLLC
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