Semiconductor package with electromagnetic shield

Details Semiconductor package with electromagnetic shield Semiconductor package with electromagnetic shield

2011-08-16

2011-08-16

Tran, Minh-Loan T (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

C257S660000, C257S508000, C257SE23114

Reexamination Certificate

active

07999359

ABSTRACT:
A semiconductor package with an electromagnetic shield is disclosed. The semiconductor package includes two substrates (102, 202; 103, 203) and an electromagnetic shield (101, 201). Each substrate has at least one die (108, 208; 112, 212) provided thereon. The electromagnetic shield is disposed between the two substrates for shielding electromagnetic interference between adjacent dies of the two substrates. One of the two substrates defines a cavity (109, 209) for partially accommodating the electromagnetic shield. Accordingly, the overall vertical height and the volume of the semiconductor package are not increased, and the heat dissipation efficiency of the semiconductor package is enhanced.

REFERENCES:
patent: 6919631 (2005-07-01), Zoba et al.
patent: 6933598 (2005-08-01), Karnezos
patent: 2005/0288392 (2005-12-01), Okubora
patent: 200639980 (2006-11-01), None

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