Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-01-31
2006-01-31
Cao, Phat X. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S690000, C438S123000
Reexamination Certificate
active
06992377
ABSTRACT:
A semiconductor package uses various forms of conductive traces that connect to die bond pads via bond wires. In one form, adjacent bond wires are intentionally crossed around midpoints thereof to reduce self-inductance of the conductors and to minimize self-inductance. In another form, bond wires associated with bond pads having intervening, unrelated bond pads are crossed. Additionally, conductive traces are divided into separate sections and electrically connected by crossed jumper wires or bond wires. Any number of separate sections may be formed for each trace, but an even number is preferable. In another form, one trace is continuous and divides a second trace into two or more sections. The multiple sections are connected by an overlying bond wire. Either insulated or non-insulated bond wire may be used.
REFERENCES:
patent: 5004317 (1991-04-01), Jackson et al.
patent: 6031281 (2000-02-01), Kang et al.
patent: 6469260 (2002-10-01), Horiuchi et al.
patent: 0 276 940 (1988-08-01), None
patent: WO 98/26452 (1998-06-01), None
patent: WO 02/080272 (2002-10-01), None
Lee Chu-Chung
Zhou Yaping
Cao Phat X.
Freescale Semiconductor Inc.
King Robert L.
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