Semiconductor package with contact springs

Details Semiconductor package with contact springs Semiconductor package with contact springs

1986-07-11

1987-02-03

Larkins, William D.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 79, 357 80, 174 52S, 339 17CF, 361408, H01L 2302, H01L 2350, H05K 712, H01R 1302

Patent

active

046411763

ABSTRACT:
An integrated circuit package for high density applications comprises spring contacts on one face thereof for its removable mounting onto a printed circuit board, the mounting being accomplished by means of a frame assembly and the package being automatically fabricable in a continuous flow process involving its assembly on a transport tape and its final cutting therefrom.

REFERENCES:
patent: 3558993 (1971-01-01), Rigby
patent: 3842189 (1974-10-01), Southgate
patent: 3904262 (1975-09-01), Cutchaw
patent: 4042861 (1977-08-01), Yasuda et al.
patent: 4079511 (1978-03-01), Grabbe
patent: 4147889 (1979-04-01), Andrews et al.
patent: 4166665 (1979-09-01), Cutchaw
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4210462 (1980-07-01), Tourneux
patent: 4223243 (1980-09-01), Oliver et al.
patent: 4264917 (1981-04-01), Ugon
patent: 4327953 (1982-05-01), Slagel et al.
patent: 4345108 (1982-08-01), Oathe et al.
patent: 4369330 (1983-01-01), Pilz

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