Semiconductor package with conductive molding compound and...

Details Semiconductor package with conductive molding compound and... Semiconductor package with conductive molding compound and...

2008-05-20

2008-05-20

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S121000, C257S685000, C257S788000

Reexamination Certificate

active

11259707

ABSTRACT:
The present invention relates to a semiconductor package having a conductive molding compound to prevent static charge accumulation. By using a conductive molding compound heat conductivity is also increased and heat generated by the semiconductor chip is more effectively dissipated externally. Additionally, the conductive compound blocks electromagnetic waves making possible an optimal semiconductor package satisfying the electromagnetic compatibility (EMC) and increasing the reliability of the semiconductor chip especially when processing high-speed signals.

REFERENCES:
patent: 5436203 (1995-07-01), Lin
patent: 6177726 (2001-01-01), Manteghi
patent: 6445060 (2002-09-01), Courtenay et al.
patent: 6889429 (2005-05-01), Celaya et al.
patent: 7141454 (2006-11-01), Matayabas et al.
patent: 2003/0024723 (2003-02-01), Igarashi et al.
patent: 10-092981 (1998-04-01), None
patent: 2004-172176 (2004-06-01), None
English language abstract of Japanese Publication No. 10-092981.
English language abstract of Japanese Publication No. 2004-172176.

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