Semiconductor package with chip supporting structure

Details Semiconductor package with chip supporting structure Semiconductor package with chip supporting structure

2006-09-05

2006-09-05

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S692000, C257S696000, C257S783000

Reexamination Certificate

active

07102218

ABSTRACT:
A semiconductor package with a chip supporting structure is provided, including a lead frame having a die pad and a plurality of leads, and a plurality of chip supporting members mounted on the die pad. Each of the chip supporting members has a first surface and an opposing second surface and has an identical height. After the second surfaces of the chip supporting members are attached to the die pad, the first surfaces of the chip supporting members are coplanarly arranged, and a chip is mounted on the first surfaces of the chip supporting members, making the chip supporting members interposed between the chip and die pad. A molding resin for encapsulating the chip is allowed to penetrate through and fill into gaps between the chip and die pad, so as to prevent void formation and assure quality of fabricated products.

REFERENCES:
patent: 5212402 (1993-05-01), Higgins, III
patent: 5214307 (1993-05-01), Davis
patent: 5233222 (1993-08-01), Djennas et al.
patent: 5327008 (1994-07-01), Djennas et al.
patent: 5521428 (1996-05-01), Hollingworth et al.
patent: 5770480 (1998-06-01), Ma et al.
patent: 5849608 (1998-12-01), Abe
patent: 6087715 (2000-07-01), Sawada et al.
patent: 6087718 (2000-07-01), Cho
patent: 6191490 (2001-02-01), Huang
patent: 6373142 (2002-04-01), Hoang
patent: 6483181 (2002-11-01), Chang et al.
patent: 6507120 (2003-01-01), Lo et al.

Affiliated with

Also associated with

Rating

Semiconductor package with chip supporting structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package with chip supporting structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package with chip supporting structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3554215