Semiconductor package with a heat spreader

Details Semiconductor package with a heat spreader Semiconductor package with a heat spreader

2006-04-11

2006-04-11

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S686000, C257S685000, C257S723000, C257S778000, C257S734000, C257S737000, C257S738000, C257S678000, C257S673000, C257S774000, C257S680000, C257S784000, C257S712000, C257S713000, C257S717000, C257S720000, C361S707000

Reexamination Certificate

active

07026719

ABSTRACT:
A semiconductor package with a heat spreader is described, including a first chip, a second chip, a heat spreader and a substrate. The first chip has an active surface over which the second chip is attached. The heat spreader is attached over the first chip. The first chip is bonded onto the substrate.

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