Semiconductor package with a heat spreader

Details Semiconductor package with a heat spreader Semiconductor package with a heat spreader

2006-03-07

2006-03-07

Hu, Shouxiang (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S712000, C257S675000, C257S796000

Reexamination Certificate

active

07009301

ABSTRACT:
A semiconductor package capable of spreading heat includes an upper PCB and a lower PCB connected to a first chip and a second chip by using gold bumps, respectively. Also the semiconductor package includes a heat spreader and thermally conductive members. The heat spreader spreads the heat generated by the first chip and the second chip. The thermally conductive members transmit the heat to the heat spreader by connecting the heat spreader to the first chip and the second chip with the thermally conductive members.

REFERENCES:
patent: 6566760 (2003-05-01), Kawamura et al.
patent: 6781241 (2004-08-01), Nishimura et al.
patent: 6927497 (2005-08-01), Meyers
patent: 2001/0000053 (2001-03-01), Suh et al.
patent: 2002/0079567 (2002-06-01), Lo et al.
patent: 2002/0130398 (2002-09-01), Huang
patent: 2002/0180058 (2002-12-01), Uchida
patent: 2002/0185734 (2002-12-01), Zhao et al.
patent: 2004/0119153 (2004-06-01), Karnezos
patent: 2004/0196635 (2004-10-01), Park et al.

Affiliated with

Also associated with

Rating

Semiconductor package with a heat spreader does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package with a heat spreader, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package with a heat spreader will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3593582