Semiconductor package with a controlled impedance bus and...

Details Semiconductor package with a controlled impedance bus and... Semiconductor package with a controlled impedance bus and...

2006-02-14

2006-02-14

Phung, Anh (Department: 2824)

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C365S063000

Reexamination Certificate

active

06999332

ABSTRACT:
An apparatus includes a first substrate having a set of semiconductor devices formed within it. The apparatus also includes a second substrate. A third substrate has a data conductor coupled between first and second connections to the second substrate. The data conductor is coupled to the set of semiconductor devices at respective connection points.

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