Semiconductor package with a bridge for chip area connection

Details Semiconductor package with a bridge for chip area connection Semiconductor package with a bridge for chip area connection

1995-06-28

1998-02-17

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361761, 361763, 361782, 361775, H05K 111, H01R 909

Patent

active

057197482

ABSTRACT:
A semiconductor package including a base having a chip receiving portion and a surrounding portion; a bridge having conductive strips extending over the chip and supported at the surrounding portion; wires connect the conductive strips to power and ground; and wires connect the conductive strips to chip area power and ground bonding pads. Decoupling capacitors may be mounted on the base.

REFERENCES:
patent: 4705917 (1987-11-01), Gates, Jr. et al.
patent: 4801999 (1989-01-01), Hayward et al.
patent: 4802062 (1989-01-01), Blum et al.
patent: 5006963 (1991-04-01), Spangler et al.
patent: 5119169 (1992-06-01), Kozono et al.
patent: 5138436 (1992-08-01), Koepf
patent: 5198963 (1993-03-01), Gupta et al.
patent: 5311058 (1994-05-01), Smolley

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