Semiconductor package using a printed circuit board and a...

Details Semiconductor package using a printed circuit board and a... Semiconductor package using a printed circuit board and a...

2005-02-08

2005-02-08

Zarabian, Amir (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S698000, C438S106000

Reexamination Certificate

active

06853060

ABSTRACT:
A semiconductor package has a substrate comprising a thermosetting resin layer of an approximate planar plate, a plurality of copper patterns formed at top and bottom surfaces of the resin layer, and protective layers coated on predetermined regions of the copper patterns and the thermosetting layer and having a same height at a surface of the resin layer. A semiconductor die is coupled to a center of the top surface of the substrate. A plurality of conductive wires for electrically coupling the semiconductor die to the copper patterns is positioned at the top surface of the resin layer. An encapsulant is used for covering the semiconductor die located at the top surface of the substrate and the conductive wires in order to protect them from the external environment. A plurality of solder balls is coupled to the bottom surface of the substrate.

REFERENCES:
patent: 6531766 (2003-03-01), Taniguchi

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