Semiconductor package that includes stacked semiconductor die

Details Semiconductor package that includes stacked semiconductor die Semiconductor package that includes stacked semiconductor die

2006-11-03

2009-11-10

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S691000, C257S692000, C257S693000, C257SE23044

Reexamination Certificate

active

07615854

ABSTRACT:
A semiconductor package that includes at least two semiconductor devices that are coupled to one another through a conductive clip.

REFERENCES:
patent: 5532512 (1996-07-01), Fillion et al.
patent: 5734201 (1998-03-01), Djennas et al.
patent: 2007/0262346 (2007-11-01), Otremba et al.

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