Semiconductor package system with through silicon via...

Details Semiconductor package system with through silicon via... Semiconductor package system with through silicon via...

2008-09-26

2011-11-22

Tran, Tan N (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S621000, C257SE23023, C257SE21511

Reexamination Certificate

active

08063475

ABSTRACT:
A semiconductor package system includes: providing a top package, a through silicon via interposer embedded in the top package; providing a bottom package having a bottom semiconductor die with a top connection adjacent the center active face thereof, a substrate interposer being embedded in the bottom package, the bottom semiconductor die being attached to the substrate interposer; and attaching the top package to the bottom package, the top package having the through silicon via interposer having a via connected to the top connection.

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