Semiconductor package system with cavity substrate

Details Semiconductor package system with cavity substrate Semiconductor package system with cavity substrate

2011-06-28

2011-06-28

Im, Junghwa M (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S110000, C438S106000, C438S118000, C257S690000, C257SE21499

Reexamination Certificate

active

07968371

ABSTRACT:
A semiconductor package system is provided including providing a cavity substrate having a cavity provided therein, attaching a metal die pad to the cavity substrate, attaching a semiconductor die in the cavity to the metal die pad, and attaching solder connectors to the cavity substrate for connection on the system board with the metal die pad on the system board.

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