Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-08-30
2005-08-30
Nguyen, Tuan H. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S738000, C257S780000, C438S613000
Reexamination Certificate
active
06936922
ABSTRACT:
An electrical substrate useful for semiconductor packages is disclosed. The electrical substrate includes a core insulative layer. A first surface of the insulative layer has circuit patterns thereon. Some of the circuit patterns are stepped in their heights from the first surface, in that a first subportion of the circuit pattern, including a ball land, extends further from the first surface than a second subportion of the same circuit pattern, and also extends further from the first surface than a ball land of other circuit patterns. Accordingly, solder balls fused to the ball lands of the stepped circuit patterns extend further from the first surface than same-size solder balls fused to the ball lands of the non-stepped circuit patterns, thereby circumventing electrical connectivity problems that may arise from warpage of the electrical substrate.
REFERENCES:
patent: 5474958 (1995-12-01), Djennas et al.
patent: 5602059 (1997-02-01), Horiuchi et al.
patent: 5620928 (1997-04-01), Lee et al.
patent: 5668405 (1997-09-01), Yamashita
patent: 5763939 (1998-06-01), Yamashita
patent: 5777387 (1998-07-01), Yamashita et al.
patent: 5786239 (1998-07-01), Ohsawa et al.
patent: 5885849 (1999-03-01), DiStefano et al.
patent: 5903052 (1999-05-01), Chen et al.
patent: 5909633 (1999-06-01), Haji et al.
patent: 6060778 (2000-05-01), Jeong et al.
patent: 6093970 (2000-07-01), Ohsawa et al.
patent: 6172419 (2001-01-01), Kinsman
patent: 6180881 (2001-01-01), Isaak
patent: 6198171 (2001-03-01), Huang et al.
patent: 6225146 (2001-05-01), Yamaguchi et al.
patent: 6242281 (2001-06-01), Mclellan et al.
patent: 6268568 (2001-07-01), Kim
patent: 6395578 (2002-05-01), Shin et al.
patent: 6399418 (2002-06-01), Glenn et al.
patent: 6448506 (2002-09-01), Glenn et al.
patent: 6452278 (2002-09-01), DiCaprio et al.
patent: 6486537 (2002-11-01), Liebhard
patent: 6501184 (2002-12-01), Shin et al.
patent: 6515356 (2003-02-01), Shin et al.
patent: 6541854 (2003-04-01), Huang et al.
patent: 6564454 (2003-05-01), Glenn et al.
patent: 6682998 (2004-01-01), Kinsman
patent: 6746894 (2004-06-01), Fee et al.
patent: 2002/0140065 (2002-10-01), Paek
patent: 2002/0180040 (2002-12-01), Camenforte et al.
Jang Sang Jae
Lee Choon Heung
Lee Seon Goo
Park Sung Soon
Park Sung Su
Amkor Technology Inc.
Gunnison McKay & Hodgson, L.L.P.
Hodgson Serge J.
Nguyen Tuan H.
LandOfFree
Semiconductor package structure reducing warpage and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package structure reducing warpage and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package structure reducing warpage and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3460529