Semiconductor package structure

Details Semiconductor package structure Semiconductor package structure

2008-08-22

2009-08-25

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S777000

Reexamination Certificate

active

07579690

ABSTRACT:
A semiconductor package structure relates to a chip-embedded semiconductor package electrically connected to a second semiconductor component. The semiconductor package structure comprises a first packaging substrate having a first surface, a second surface and at least a first cavity penetrating through the first surface and the second surface. The semiconductor package structure includes a first semiconductor component with electrode pads disposed in the first cavity. A first build-up circuit structure comprising a plurality of third and fourth conductive pads, and a second semiconductor component with electrode pads is disposed on surfaces of the third conductive pads by a first conductive element. The semiconductor package structure also includes a second conductive element disposed on the fourth conductive pads of the first build-up circuit structure of the first packaging substrate and a stacked structure electrically connecting the stacked structure to the first build-up circuit structure disposed on the first packaging substrate.

REFERENCES:
patent: 6472736 (2002-10-01), Yeh et al.
patent: 6787869 (2004-09-01), Vittu

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