Semiconductor package socket

Details Semiconductor package socket Semiconductor package socket

1997-06-06

1999-02-02

Paumen, Gary F.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

324754, 324761, G01R 3102

Patent

active

058656324

ABSTRACT:
A semiconductor package socket comprises an insulating support substrate, pin contacts arranged in a constant-pitch lattice-array and which are attached in a manner that permits advance or retreat in a direction which is almost perpendicular to a main surface of the support substrate, a pin contact movement driving mechanism which advances or retreats the pin contacts en bloc, and a guide frame which has spaces to accommodate said pin contacts, which is freely detachable and which can cover areas other than those required by the pin contacts.

REFERENCES:
patent: 4352061 (1982-09-01), Matrone
patent: 4358175 (1982-11-01), Reid
patent: 5534787 (1996-07-01), Levy
patent: 5688127 (1997-11-01), Staab et al.

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