Semiconductor package security features using...

Details Semiconductor package security features using... Semiconductor package security features using...

2006-12-26

2006-12-26

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

C359S288000, C345S106000, C430S010000

Reexamination Certificate

active

07154170

ABSTRACT:
Numerous embodiments of an apparatus and method for generating an identification feature are described. In one embodiment of the present invention, portions of an identification character printed with thermochromatic ink are distributed within a three-dimensional matrix of a multi-layer patch. The multi-layer patch may be disposed above a substrate.

REFERENCES:
patent: 4922242 (1990-05-01), Parker
patent: 5223958 (1993-06-01), Berry
patent: 5673028 (1997-09-01), Levy et al.
patent: 6229514 (2001-05-01), Larson
patent: 6444377 (2002-09-01), Jotcham et al.
patent: 6580413 (2003-06-01), Walsh
patent: 6616190 (2003-09-01), Jotcham
patent: 6665406 (2003-12-01), Phillips
patent: 6800106 (2004-10-01), Cogar et al.
patent: 6872453 (2005-03-01), Arnaud et al.
patent: 2003/0052305 (2003-03-01), Coates et al.
patent: 2004/0017295 (2004-01-01), Dishongh et al.
patent: 1 066 978 (2001-01-01), None
patent: 1 243 442 (2002-09-01), None
patent: 63 244652 (1988-10-01), None
patent: 11 154210 (1999-06-01), None
patent: PCT/US2005/010531 (2005-08-01), None

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