Semiconductor package, method for fabricating the same, and...

Details Semiconductor package, method for fabricating the same, and... Semiconductor package, method for fabricating the same, and...

2008-07-22

2008-07-22

Jackson, Jerome (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S666000, C257S099000, C257S177000, C438S106000

Reexamination Certificate

active

11196321

ABSTRACT:
A semiconductor device includes a semiconductor chip, leads for sending and receiving signals between the semiconductor chip and an external device, fine metal wires, an encapsulant for sealing the leads, and a lid member. On the surface of each of the leads, a metal oxide film is formed by an oxidation treatment. The metal oxide film has a thickness larger than a natural oxide film and no more than 80 nm.

REFERENCES:
patent: 5937279 (1999-08-01), Sawada et al.
patent: 6087713 (2000-07-01), Haruta
patent: 6087715 (2000-07-01), Sawada et al.
patent: 2003/0075792 (2003-04-01), Ruhland
patent: 62200752 (1987-09-01), None
patent: 9-55489 (1997-02-01), None

Affiliated with

Also associated with

Rating

Semiconductor package, method for fabricating the same, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package, method for fabricating the same, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package, method for fabricating the same, and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3949466