Semiconductor package lead deflash method

Details Semiconductor package lead deflash method Semiconductor package lead deflash method

1997-01-17

1997-12-02

Picardat, Kevin

Fishing, trapping, and vermin destroying

437209, 437217, H01L 2160

Patent

active

056935730

ABSTRACT:
A semiconductor package lead deflash method comprises the steps of forming a plating thin film on a plurality of leads, weakening an adhesive force of the plating thin film, and removing a flash and the plating thin film formed therebeneath respectively from the plurality of leads. The lead deflash method enables complete elimination of the lead flash formed during a package fabrication, and additionally serves as a pollution deterrent by adopting a chemical-free deflash method.

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