Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Patent
1999-02-18
1999-11-30
Font, Frank G.
Optics: measuring and testing
Inspection of flaws or impurities
Surface condition
356394, 348126, 382145, 382146, G01N 2188, H04N 718, G06K 903
Patent
active
059952202
ABSTRACT:
A semiconductor package inspection apparatus comprises single photographic device disposed above the semiconductor package, and comprises light splitter for splitting light in different directions according to three different wavelength ranges in the light; and three image pickup units for separately photographing light of the three wavelength ranges which has been split by the light splitter; lighting device comprising first lighting for inspecting leads of the semiconductor package; second lighting for inspecting marks printed on top face of the semiconductor package; and third lighting for inspecting defects of the semiconductor package, the first, second and third lightings being disposed at locations different from each other, and having wavelength ranges into which the light has been split by the light splitter, and inspection device for simultaneously operating the first, second and third lightings of the lighting device and the three image pickup units of the photographic device to inspect leads of the semiconductor package, marks printed on top face of the semiconductor package and defects in the semiconductor package based on the photographic data from the three image pickup units.
REFERENCES:
patent: 5030008 (1991-07-01), Scott et al.
patent: 5039868 (1991-08-01), Kobayashi et al.
patent: 5298963 (1994-03-01), Moriya et al.
patent: 5528371 (1996-06-01), Sato et al.
Font Frank G.
Komatsu Ltd.
Smith Zandra V.
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