Semiconductor package having strengthening and sealing upper cha

Details Semiconductor package having strengthening and sealing upper cha Semiconductor package having strengthening and sealing upper cha

1978-11-27

1981-02-03

Tolin, Gerald P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 1705, 357 72, 361386, H05K 720

Patent

active

042490340

ABSTRACT:
A semiconductor device is described wherein a semiconductor pellet is disposed within a hermetically sealed chamber including a thermally conductive base and a substantially rigid housing, said housing including an open upper chamber in which are disposed electrical terminals and which is filled with a sealing and strengthening layer to substantially increase the strength and hermeticity of the package.

REFERENCES:
patent: 3217213 (1965-11-01), Slater
patent: 3237063 (1966-02-01), Keller
patent: 3268309 (1966-08-01), Frank
patent: 3293510 (1966-12-01), Pfaffenberger
patent: 3311798 (1967-03-01), Gray
patent: 3717523 (1973-02-01), Dunsche
patent: 3769560 (1973-10-01), Miyake
patent: 3904939 (1975-09-01), Carino

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